Metrology and Characterization II
Wednesday, May 31, 2023
M - Materials engineering for advanced semiconductor devices
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M09
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10:00 AM
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12:00 PM
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Metrology and Characterization II
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Schuman (1st floor)
M - Materials engineering for advanced semiconductor devices
10:00 AM
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2577
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Combining cutting-edge metrology techniques and TCAD to support device integration towards the 2nm Technological Node and Beyond
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P.
Pierre
EYBEN (Leuven)
10:30 AM
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1933
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Scanning Spreading Resistance microscopy on dopant profiles in elemental and compound semiconductors
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T.
Tim
BÖCKENDORF (Münster)
10:45 AM
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391
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Local Strain and Alloy Composition in Ge1-xSnx Microdisks: A Study by X-ray Nanoprobe
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I.
Ignatii
ZAITSEV (Frankfurt (Oder))
11:00 AM
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864
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Capacitance-Voltage Measurements on SiC-Based MOS Structures: What Information Can We Get from Them?
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A.
Alex
BURENKOV (Erlangen)
11:15 AM
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1399
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On the bulk photovoltaic effect in non-uniformly strained Germanium
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C.
Costanza Lucia
MANGANELLI (Frankfurt (Oder))
11:30 AM
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1447
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Deep multi-energy proton implantation in silicon: a SIMS study
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O.
Orazio
SAMPERI (Catania)
11:45 AM
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1713
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Photoemission Spectroscopy on photoresist materials: A useful tool to use with caution
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F.
Faegheh
SAJJADIAN (Leuven)
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