Metrology and Characterization II

Wednesday, May 31, 2023
M - Materials engineering for advanced semiconductor devices M09 10:00 AM > 12:00 PM Metrology and Characterization II Schuman (1st floor) M - Materials engineering for advanced semiconductor devices

10:00 AM 2577 Combining cutting-edge metrology techniques and TCAD to support device integration towards the 2nm Technological Node and Beyond > P. Pierre EYBEN (Leuven) 10:30 AM 1933 Scanning Spreading Resistance microscopy on dopant profiles in elemental and compound semiconductors > T. Tim BÖCKENDORF (Münster) 10:45 AM 391 Local Strain and Alloy Composition in Ge1-xSnx Microdisks: A Study by X-ray Nanoprobe > I. Ignatii ZAITSEV (Frankfurt (Oder)) 11:00 AM 864 Capacitance-Voltage Measurements on SiC-Based MOS Structures: What Information Can We Get from Them? > A. Alex BURENKOV (Erlangen) 11:15 AM 1399 On the bulk photovoltaic effect in non-uniformly strained Germanium > C. Costanza Lucia MANGANELLI (Frankfurt (Oder)) 11:30 AM 1447 Deep multi-energy proton implantation in silicon: a SIMS study > O. Orazio SAMPERI (Catania) 11:45 AM 1713 Photoemission Spectroscopy on photoresist materials: A useful tool to use with caution > F. Faegheh SAJJADIAN (Leuven)

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