Integration Challenges
Monday, May 29, 2023
M - Materials engineering for advanced semiconductor devices
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M01
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8:45 AM
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10:00 AM
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Integration Challenges
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Schuman (1st floor)
M - Materials engineering for advanced semiconductor devices
8:45 AM
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2740
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Recent advances in 3D sequential integration
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L.
Laurent
BRUNET (Grenoble)
9:15 AM
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958
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Reconfigurable Field-Effect Transistor Technology via Heterogeneous Integration of SiGe with Crystalline Al Contacts
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L.
Lukas
WIND (Vienna)
9:30 AM
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1411
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Engineering of HZO layer for the fabrication of ultimate 3D vertical transistors for Memory-in-Logic applications
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K.
Konstantinos
MOUSTAKAS (Toulouse)
9:45 AM
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817
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Isotopically Enriched 28Si Substrates for Quantum Computers Produced Using Ion Implantation Layer Exchange
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J.
Jonathan
ENGLAND (Horsham)
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